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www.p-tec.net 102214 rev0 jas page 1 of 15 product specification part number PLBT5252 white rgb series details ? high power 5252 led ? 5.2 x 5.2 x 3.1mm ? 500 piece reels ? emitting color: white ? ingan based phosphor-converted led features ? esd 2kv (hbm : mil-std-883) ? msl 2 qualified according to j-std 020 ? rohs and reach-compliant notes: 1. specifications subject to change.
www.p-tec.net 102214 rev0 jas page 2 of 15 mechanical dimensions
www.p-tec.net 102214 rev0 jas page 3 of 15 notes: 1. dimension in millimeter [inch], and tolera nce is 0.13mm unless otherwise noted.
www.p-tec.net 102214 rev0 jas page 4 of 15 device selection guide luminous flux (lm) (350ma) wavelength(nm)/cct(k (350ma) forward voltage (v)(350ma) part number color min max min max min max cool white 65 90 5000 8220 2.8 3.4 red 30 55 620 630 2.0 2.6 green 60 90 520 530 2.6 3.2 PLBT52523w- ydcwrgb (flat lens) blue 14 24 455 465 2.8 3.4 cool white 65 90 5000 8220 2.8 3.4 red 30 55 620 630 2.0 2.6 green 60 90 520 530 2.6 3.2 PLBT5252r3w- ydcwrgb (round lens) blue 14 24 455 465 2.8 3.4 warm white 65 90 5000 8220 2.8 3.4 red 30 55 620 630 2.0 2.6 green 60 90 520 530 2.6 3.2 PLBT52523w- ydwwrgb1 (flat lens) blue 14 24 455 465 2.8 3.4 cool white 65 90 5000 8220 2.8 3.4 red 30 55 620 630 2.0 2.6 green 60 90 520 530 2.6 3.2 PLBT52523w- ydcwrgb2 (flat lens) blue 14 24 455 465 2.8 3.4 notes: 1. forward voltage (vf)0.05v, luminous flux ( v) 5% 2. is standard testing. absolute maximum ratings at ta=25c parameter symbol min. typ. max. unit dc forward current (note1) if - 350 1000 ma pulse forward current (note2) ipf - - 1200 ma forward voltage (350ma) white vf 2.8 - 3.4 v forward voltage (350ma) red vf 2.0 - 2.6 v forward voltage (350ma) green vf 2.6 - 3.2 v forward voltage (350ma) blue vf 2.8 - 3.4 v reverse voltage vr - -5 - v leakage current (5v) ir - - 10 a junction temperature (note3) tj - 150 - c storage temperature range tstg -40 - 100 c soldering temperature tsol - - 260 c thermal resistance junction/solder point rth 4 - 6 c/w viewing angle 2 1/2 - 120/130 - deg notes: 1. for other ambient, limited setting of cu rrent will depend on de-rating curves. 2. d=0.01s duty 1/10. 3. when drive on maximum current , tj must be kept below 150 4. viewing angle (2 1/2) 10
www.p-tec.net 102214 rev0 jas page 5 of 15 intensity binning white series bin code (350ma) min. v (lm) max. v (lm) b24 45 50 b25 50 55 b26 55 60 b27 60 65 b28 65 70 b29 70 75 b30 75 80 b31 80 90 b32 90 100 b33 100 110 b34 110 120 b35 120 130 red series bin code (350ma) min. v (lm) max. v (lm) b21 30 35 b22 35 40 b23 40 45 b24 45 50 b25 50 55 b26 55 60 b27 60 65 b28 65 70 green series bin code (350ma) min. v (lm) max. v (lm) b27 60 65 b28 65 70 b29 70 75 b30 75 80 b31 80 90 b32 90 100 b33 100 110 b34 110 120 b35 120 130
www.p-tec.net 102214 rev0 jas page 6 of 15 blue series bin code (350ma) min. v (lm) max. v (lm) b13 14 16 b14 16 18 b15 18 20 b16 20 22 b17 22 24 b18 24 26 b19 26 28 recommended solder pad
www.p-tec.net 102214 rev0 jas page 7 of 15 color coordinate binning
www.p-tec.net 102214 rev0 jas page 8 of 15 typical electrical / optical characteristic curves typical spatial distribution
www.p-tec.net 102214 rev0 jas page 9 of 15 relative spectral power distribution thermal design for de-rating the maximum forward current is determined by the thermal resistan ce between the led junction and ambient. it is crucial for the end product to be designed in a manner that mini mizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics.
www.p-tec.net 102214 rev0 jas page 10 of 15 packaging
www.p-tec.net 102214 rev0 jas page 11 of 15 notes: 1. reeled products (minimum number of pieces is 10 and maximum is 500) packed in sealed moisture-proof bags along with a desiccant; 2. a maximum of five moisture-proof bags packed in side the box (size: 240mm x 200mm x 105mm 5mm) and a maximum of four inside boxes are put in the outsi de box (size: 410mm x 255mm x 240mm 5mm) together with buffer material packed. 3. (part no., lot no., quantity should appear on the label of the moisture-proof bag and the cardboard box.) label label ? label ?
www.p-tec.net 102214 rev0 jas page 12 of 15 reflow profile lead free solder 25 2-5/sec 10sec. max 2-5/sec 120sec.max 50sec.max 0 50 100 150 200 250 300 0 50 100 150 200 250 300 sec 1-5/sec pre heating 150-180 260 max 230 max time temperatur e lead solder 25 2-5/sec 10sec. max 2-5/sec 120sec.max 50sec.max 0 50 100 150 200 250 300 0 50 100 150 200 250 300 sec 1-5/sec pre heating 150-180 240 max 210 max time temperature notes: 1. the recommended reflow temperature is 240 (5 ). the maximum soldering temperature should be limited to 260 . 2. do not stress the silicone resi n while it is exposed to high temperature. 3. the number of reflow process should not exceed 3 times.
www.p-tec.net 102214 rev0 jas page 13 of 15 precautions 1. recommendation for using leds 1.1 the lens of leds should not be exposed to dust or debr is. excessive dust and debris may cause a drastic decrease in the luminosity. 1.2 avoid mechanical stress on led lens. 1.3 do not touch the led lens surface. it would affect th e optical performance of th e led due to the led lens? damage. 1.4 pick & place tools are recommended for the remove of leds from the factory tape & reel packaging 2. pick & place nozzle the pickup tool was recommended and shown as below 3. lens handling please follow the guideline to pick leds 3.1 use tweezers to pick leds 3.2 do not touch the lens by using tweezers 3.3 do not touch lens with fingers 3.4 do not apply more than 4n of lens (400g) directly onto the lens
www.p-tec.net 102214 rev0 jas page 14 of 15 correct ( ) wrong ( x ) 4. lens cleaning in the case which a small amount of di rt and dust particles remain on the lens surface, a suitable cleaning solution can be applied. 4.1 try a gentle wiping with dust-free cloth 4.2 if needed, use dust-free cloth and isopropyl alcohol to gently clean the dirt from the lens surface. 4.3 do not use other solvents as they may directly react with the led assembly 4.4 do not use ultrasonic cleaning which will damage the leds 5. carrier tape handling the following items are reco mmended when handling the carrier tape of leds 5.1 do not twist the carrier tape 5.2 the inward bending diameter should not be smaller than 6cm for each carrier tape. 5.3 do not bend the tape outward. < < 6 6 c c m m ?
www.p-tec.net 102214 rev0 jas page 15 of 15 reliability notes: 1. usl: upper specification level 2. lsl: lower specification level test item test conditions duration/ cycle number of damage reference thermal shock -40c 30min 5min 125 30min 100 cycles 0/22 jeita ed-4701 300 307 high temperature storage t a =100c 1000 hrs 0/22 eiaj ed-4701 200 201 humidity heat storage t a =85 rh=85% 1000 hrs 0/22 eiaj ed-4701 100 103 low temperature storage t a =-40 1000 hrs 0/22 eiaj ed-4701 200 202 life test t a =25 if=500ma 1000 hrs 0/22 tested with factory standard high humidity heat life test 85 rh=85% if=500ma 1000 hrs 0/22 tested with factory standard high temperature life test t a =85 1000 hrs 0/22 tested with factory standard esd(hbm) 2kv at 1.5k ? ;100pf 3 times 0/22 mil-std-883 criteria for judging the damage criteria for judgment item symbol condition min max forward voltage vf if=350a - usl 1 1.1 luminous intensity i v if=350ma lsl 2 0.7 -

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